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1 / 21 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 2.7v to 5.5v, 3a 1ch synchronous buck converter integrated fet BD8963EFJ general description rohms high efficiency step - down switching regulator bd896 3efj is a power supply designed to produce a low voltage including 1 volts from 5 .5/3.3 volts power s upply line. offers high efficiency with synchronous rectifier. employs a current mode control system to provide faster transient response to sudden change in load. features ? offers fast transient response with current mode pwm control system. ? offers highl y efficiency for all load range with synchronous rectifier (nch/pch fet) ? incorporates soft - start function. ? incorporates thermal protection and ulvo functions. ? incorporates short - current protection circuit with time delay function. ? incorporates shutdown fun ction applications p ower supply for lsi including dsp, micro computer and asic key specification ? i nput voltage range: 2.7v to 5.5v ? o utput voltage range: 1.0v to 2.5v ? average output current: 3 a ( max. ) ? switching frequency: 1mhz(typ.) ? pch fet on resistance: 145m (typ.) ? nch fet on resistance: 80m (typ.) ? s tandby current: 5 a ( typ. ) ? operating temperature range : - 25 to +85 package (typ.) (typ.) (max.) htsop - j8 4.90mm x 6.00mm x 1.00mm typical application circuit gnd sw v cc en adj comp v cc v out cin r comp c comp l esr c o r o v out fig. 1 typical application circuit htsop - j8 product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays.
2 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 pin configuration(top view) pin no. pin name pin function 1 comp gmamp output pin/connected phase compensation capacitor 2 gnd ground 3 en enable pin(active high, open active) 4 v cc vcc power supply input pin 5 sw pch/nch fet drain output pin 6 sw pch/nch fet drain output pin 7 n.c non connect 8 adj output voltage detect pin block diagram fig. 2 pin configuration comp gn d v cc sw n.c adj en sw fig. 3 block diagram sw sw v cc gnd
3 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol ratings unit v cc voltage v cc - 0.3 to +7 *1 v en voltage v en - 0.3 to +7 v sw,comp voltage v sw ,v comp - 0.3 to +7 v power dissipation 1 pd1 0.5 *2 w power dissipation 2 pd2 3.76 *3 w operating temperature range topr - 25 to +85 storage temperature range tstg - 55 to +150 maximum junction temperature tjmax +1 50 *1 pd should not be exceeded . *2 reduced by 4.0mw for increase in ta of 1 above 25 . *3 reduced by 30.0mw for increase in ta of 1 above 25 . (when mounted on a board 70.0mm 70.0mm 1.6mm glass - epoxy pcb) (ta= - 25 to +85 ) parameter symbol ratings unit min. typ. max. power supply voltage v cc 2.7 *5 5.0 5.5 v en voltage v en 0 - vcc v output voltage range v out 1.0 - 2.5 *4 v sw average output current isw - - 3.0 *5 a *4 in case set output voltage 1.6v or more, vccmin. = vout +2.25v *5 pd should not be exceeded. ( u nless otherwise specified , ta=25 v cc =5v, en=v cc , r 1 =20k , r 2 =7.5k ) p arameter s ymbol l imit u nit conditions min. typ. max. standby current i stb - 5 20 a en=gnd bia s current i cc - 350 600 a en low voltage v enl - gnd 0.3 v stand - by mode en high voltage v enh 2.0 v cc - v active mode en current i en - 1.25 10 a v en =5v oscillation frequency f osc 0.8 1 1.2 mhz pch fet on resistance r onp - 145 290 m cc =5v nch fe t on resistance r onn - 80 160 m cc =5v adj reference voltage v adj 0.788 0.800 0.812 v comp s ink c urrent i cosi 10 25 - a v adj =1.0v comp s ource current i coso 10 25 - a v adj =0.6v uvlo threshold voltage v uvlo 1 2.400 2.500 2.600 v vcc=5v uvlo 2 2.425 2.550 2.700 v vcc=0v ss 0.5 1 2 ms timer latch time t latch 1 2 4 ms output short circuit threshold voltage v scp - v out out out =1.0v
4 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves fig.4 vcc - vout fig.6 i out - v out fig. 7 ta - v out fig.5 v en - vout
5 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 fig.9 ta - f osc fig. 10 ta - r onn , r onp fig. 11 ta - v en fig.8 efficiency efficiency[%]
6 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 fig.14 soft start waveform fig.15 sw waveform io=10ma fig.12 ta - i cc fig.13 vcc - f osc
7 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 fig. 16 transient response io=0.5a 1.5a(10s) fig. 17 transient response io=1.5a 0.5a(10s )
8 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 application information o peration synchronous rectifier it does not require the power to be dissipated by a rectifier externally connected to a conventional dc/dc converter ic, and its p . n junction shoot - through protection circuit limits the shoot - through current during operation, by whic h the power dissipation of the set is reduced. current mode pwm control synthesizes a pwm control signal with a inductor current feedback loop added to the voltage feedback. ? pwm (pulse width modulation) control the oscillation frequency for pwm is 1 mhz . set signal form osc turns on a p - channel mos fet (while a n - channel mos fet is turned off), and a n inductor current i l increases. the current comparator (current comp) receives two signals, a current feedback control signal (sense: voltage converted fr om i l ) and a voltage feedback control signal (fb), and issues a reset signal if both input signals are identical to each other, and turns off the p - channel mos fet (while a n - channel mos fet is turned on) for the rest of the fixed period. the pwm control repeat this operation. fig. 1 8 diagram of current mode pwm control fig. 1 9 pwm switching timing chart current comp set reset sw v out pvcc gnd gnd gnd i l (ave) v out (ave) sense fb current comp set reset sw v out i l osc level shift driver logic r q s i l sw comp current comp gm amp. set reset fb load sense v out v out
9 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 description of operations ? soft - start function en terminal shifted to high activates a soft - starter to gradually establish the output voltage with the current limited during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. ? shutdown function with en terminal shifted to low, the device turns to standby mode, and all the function blocks including referenc e voltage circuit, internal oscillator and drivers are turned to off. circuit current during standby is 5 a (typ.). ? uvlo function detects whether the input voltage sufficient to secure the output voltage of this ic is supplied. and the hysteresis width of 50 mv (typ.) is provided to prevent output chattering. fig.20 soft start, shutdown, uvlo timing chart ? short - current protection circuit with time delay function turns off the output to protect the ic from breakdown when the i ncorporated current limiter is activated continuously for the fixed time(t latch ) or more . the output thus held tuned off may be recovered by restarting en or by re - unlocking uvlo. fig.2 1 short - current protection circuit with time dela y timing chart t2=t latch output off latch en v out output short circuit threshold voltage i l standby mode operating mode operating mode en timer latch en standby mode i l limit t1 10 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 advantage 1 : offers fast transient response with current mode control system. voltage drop due to sudden change in load was reduced by about 50 %. fig. 2 2 comparison of transient response advantage 2 : offers high efficiency with synchronous rectifier utilizes the synchronous rectifying mode and the low on - resistance mos fets incorporated as power transistor. o n resistance of p - channel mos fet : 145m (typ.) on resistance of n - channel mos fet : 80m (typ.) advantage 3 : ? supplied in smaller package due to small - sized p ower mos fet incorporated. reduces a mounting area required. fig. 2 4 example application dc/dc convertor controller r comp l co v out c comp v cc cin 10mm 15mm r comp c comp c in c o l ? ? o = 0.5a o = 0.5a v out i out v out i out 75mv 36mv fig. 2 3 efficiency vcc=5.0v ta=2 5 v out =1.1v 0 10 20 30 40 50 60 70 80 90 100 10 100 1000 10000 output current:i out [ma] efficiency: [%]
11 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 switching regulator efficiency efficiency ? may be expressed by the equ ation shown below: efficiency may be improved by reducing the switching regulator power dissipation factors p d as follows: dissipation factors: 1) on resistance dissipation of inductor and fet pd(i 2 r) 2) gate charge/discharge dissipation pd(gate) 3) switching dissipation pd(sw) 4) esr dissipation of capacitor pd(esr) 5) operating current dissipation of ic pd(ic) 1)pd(i 2 r)=i out 2 (r coil +r on ) (r coil [ ] d c resistance of inductor , r on [ ] on resistance of fet , i out [a] output current. ) 2)pd(ga te)=cgs f v 2 (cgs[f] gate capacitance of fet , f[h z ] switching frequency , v[v] gate driving voltage of fet ) 4)pd(esr)=i rms 2 esr (i rms [a] ripple current of capacitor , esr[ ] equivalent series resistance. ) 5)pd(ic)=vin i cc (i cc [a] circuit current. ) = out i out viniin 100[%]= p out pin 100[%]= p out p out +p d 2 c rss i out f i drive 3)pd(sw)= (c rss [f] drive [a]
12 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 0.50w 0.82w 1.10w 2.11w 3.76w consideration on permissible dissipation and heat generation as this ic functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. in case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. for dissipation, only conduction losses due to dc resistance of inductor and on resistance of fet are considered. because the conduction losses are considered to play the leading role among other dissipation mentioned above including gate charge/discharge dissipation and switching dissipation. ex.)v cc =5v, v out =1.1v, r onp =0.145 , r onn =0.08 i out =3a , for example, d=v out /v cc =1.1/5=0.22 r on =0.22 0.145+(1 - 0.22) 0.08 =0.0319+0.0624 =0.0943[ ] p=3 2 0.0943=0.8487[w] as r onp is greater than r onn in this ic, the dissipation inc reases as the on duty becomes greater. with the consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed. fig.25 thermal derating curve (htsop - j8) ic only j - a=249.5 /w 1 layers copper foil area:0mm 0mm j - a=153.2 /w 2 layers copper foil area:15mm 15mm j - a=113.6 /w 2 layers copper foil area:70mm 70mm j - a=59.2 /w 4 layers copper foil area:70mm 70mm j - a=33.3 /w (when mounted on a board 70 mm 70mm 1.6mm glass - epoxy pcb with termal via) p=iout 2 ron ron=d ronp+(1 - d)ronn d on duty (=vout/vcc) rcoil d c resistance of coil ronp on resistance of p - channel mos fet ronn on resistance of n - channel mos fet iout output current 0 1 2 3 4 0 25 50 75 100 125 150 ambient temperature:ta [] power dissipation:pd [w] 85
13 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 selection of components externally connected 1. selection of inductor (l) *current exceeding the current rating of the inductor results in magnetic saturation of the inductor, which decreases efficiency. t he inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating. if v cc =5v, v out =1.1v, f=1mhz, i l =0.2 3a=0.6a , for example, (BD8963EFJ) *select the inductor of low resistance component (such as dcr and acr) to minimize dissipation in the inductor for better efficiency. 2. selection of output capacitor (c o ) 3. selection of input capacitor (cin) a low esr 22 f/10v ceramic capacitor is recommended to reduce esr dissipation of input capacitor for better efficiency. the inductance significantly depends on output ripple current. as seen in the equation (1), the ripp le current decreases as the inductor and/or switching frequency increases. l = (v cc - v out ) out l cc ??? l =0.2 out max. [a] ??? cc - v out ) out l cc ??? l : output ripple current, and f: switching frequency ) output capacitor should be selected with the consideration on the stability region and the equivalent series resistance req uired to smooth ripple voltage. output ripple voltage is determined by the equation (4) out = l ??? l : output ripple current , esr: equivalent series resistance of output capacitor ) *rating of the capacitor should be determined allowing sufficient margin against output voltage. a 10 f to 100 f ceramic capacitor is recommended. less esr allows reduction in output ripple voltage. input capacitor to select must be a low esr capacitor of the capacitance sufficient to cope with high ripple current to prevent high transient voltage. the ripple current i rms is given by the equation ( 5 ): fig.27 output capacitor (5 - 1.1) i l v cc il l co v out fig.26 output ripple current i l v cc l co v out esr v cc l co v out cin i rms =i out out (v cc - v out ) v cc [a] ??? out , i rms = i out 2 < worst case > i rms(max.) i rms =3 rms ] cc =5v, v out =1.1v, and i outmax.= 3a, (BD8963EFJ)
14 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 4. determination of r comp , c comp that works as a phase compensator as the cur rent mode control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a cr filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to t he output capacitor and its esr. so, the phases are easily compensated by adding a zero to the power amplifier output with c and r as described below to cancel a pole at the power amplifier. stable feedback loop may be achieved by canceling the pole fp (min.) produced by the output capacitor and the load resistance with cr zero correction by the error amplifier. fig .29 open loop gain characteristics fig.30 error amp phase compensation characteristics gnd sw v cc en adj comp v cc v out cin r comp c comp l esr c o r o v out fig.31 typical application fz (am p.) = fp (min.) 2 comp comp 1 = 2 omax. o 1 gain [db] phase [deg] a 0 0 - 90 a 0 0 - 90 fz(amp.) fp(min.) fp(max.) fz(esr) i out min. i out max. gain [db] phase [deg] fp= 2 o o 1 fz (esr) = 2 sr o 1 pole at power amplifier when the output current decreases, the load resistance ro increases and the pole frequency lowers. fp (min.) = 2 omax. o 1 [hz] (max.) = 2 omin. o 1 [hz] (amp.) = 2 ith ith 1 increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (this is because when the capacitance is doubled, the capacitor esr reduces to half.)
15 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 5. determination of output voltage the output voltage v o ut is determined by the equation ( 6 ): v out =(r2/r1+1) v adj ??? (6) v adj : voltage at adj terminal (0.8v typ.) with r1 and r2 adjusted, the output voltage may be determined as required. adjustable output voltage range : 1.0v to 2.5v fig.32 determinat ion of output voltage use 1 k? to 100 k? resistor for r1. if a resistor of the resistance higher than 100 k? is used, check the assembled set carefully for ripple voltage etc. fig.33 m inimum input voltage in each output voltage the lower limit of input voltage depends on the output voltage. basically, it is recommended to use in the condition : v ccmin = v out +2.25v. fig.33. shows the necessary output current value at the lower limit of input voltage. (dcr of inductor : 0.05 sw 6 8 adj l co r2 r1 output 5 vo=2.5v vo=1.8v vo=1.5v vo=2.0v 2.7 3.2 3.7 4.2 4.7 0 0.5 1 1.5 2 2.5 3 output current : iout[a] in pu t voltage : vcc [v]
16 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 cautions on pc board layout to avoid conduction loss, please keep black thick line as short and thick as possible. don't close to switching current loop. close to ic pin as possible. keep pcb trace as short as possible. use single point ground structure to connect with pin2 . close to c2 as possible. htsop - j8 (BD8963EFJ) has thermal pad on the reverse of the package. the package thermal performance may be enhanced by bonding the pad to gnd plane which take a large area of pcb. fig.34 layout diagram
17 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 top layer middle layer bottom layer fig.35 reference pcb layout pattern top silkscreen overlay b ottom silkscreen overlay
18 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 recommended components lists on above application symbol part value manufacturer series l coil 1.5h tdk vlc6045t - 1r5n cin ceramic capacitor vcc - vout>3v 10f kyocera cm 316 x5r 106 m10a vcc - vout<3v 22f kyocera cm32x5r226m10a co cera mic capacitor 10f kyocera cm 316 x5r 106 m10a ccomp ceramic capacitor vout=1.0v 330pf murata g rm 18 seri e s vout=1.1v 330pf murata g rm 18 seri e s vout=1.2v 330pf murata g rm 18 seri e s vout=1.5v 390pf murata g rm 18 seri e s vout=1.8v 390pf murata g rm 18 se ri e s vout=2.5v 390pf murata g rm 18 seri e s rcomp resistance vout=1.0v 2k rohm mcr03 seri e s vout=1.1v 2k rohm mcr03 seri e s vout=1.2v 2.4k rohm mcr03 seri e s vout=1.5v 2.4k rohm mcr03 seri e s vout=1.8v 3.6k rohm mcr03 seri e s vout=2.5v 5.6k rohm mcr03 series * the parts list presented above is an example of recommended parts. although the parts are sound, actual circuit characteristics should be checked on your application carefully before use. be sure to allow sufficient margins to accommodate variations between external devices and this ic when employing t he depicted circuit with other circuit constants modified. both static and transient characteristics should be considered in establishing these margins. i/o equivalence circuit BD8963EFJ fig.36 i/o equivalence circuit ? ? ? comp v cc ? adj en sw v cc v cc v cc
19 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes 1. absolute maximum ratings while utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operating temperature range may result in breakage. if broken, short - mode or open - mode may not be identified. so if it is expected to encounter with special mode that may exceed the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses. 2. electrical potential at gnd gnd must be designed to have the lowest electrical potential in any operating conditions . 3. short - circuiting between terminals, and mismounting when mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. failure to do so may result in ic breakdown. short - circuiting due to foreign matters entered between output terminals, or between output and powe r supply or gnd may also cause breakdown. 4. operation in strong electromagnetic field be noted that using the ic in the strong electromagnetic radiation can cause operation failures. 5. thermal shutdown protection circuit thermal shutdown protection circ uit is the circuit designed to isolate the ic from thermal runaway, and not intended to protect and guarantee the ic. so, the ic the thermal shutdown protection circuit of which is once activated should not be used thereafter for any operation originally intended. 6. inspection with the ic set to a pc board if a capacitor must be connected to the pin of lower impedance during inspection with the ic set to a pc board, the capacitor must be discharged after each process to avoid stress to the ic. for electr ostatic protection, provide proper grounding to assembling processes with special care taken in handling and storage. when connecting to jigs in the inspection process, be sure to turn off the power supply before it is connected and removed. 7. input to i c terminals this is a monolithic ic with p + isolation between p - substrate and each element as illustrated below. this p - layer and the n - layer of each element form a p - n junction, and various parasitic element are formed. if a resistor is joined to a tra nsistor terminal as shown in fig 37. p - n junction works as a parasitic diode if the following relationship is satisfied; gnd>terminal a (at resistor side), or gnd>terminal b (at transistor side); and if gnd>terminal b (at npn transistor side), a pa rasitic npn transistor is activated by n - layer of other element adjacent to the above - mentioned parasitic diode. the structure of the ic inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. it is therefore requested to take care not to use the device in such manner that the voltage lower than gnd (at p - substrate) may be applied to the input terminal, which may result in activation of parasitic elements. fig.37 simplified structure of monorisic ic 8. ground wiring pattern if small - signal gnd and large - current gnd are provided , it will be recommended to separate the large - current gnd pattern from the small - signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of th e small - signal gnd. pay attention not to cause fluctuations in the gnd wiring patter n of external parts as well. 9. selection of inductor it is recommended to use an inductor with a series resistance element (dcr) 0.1 or less. especially, in case output voltage is set 1.6v or more, note that use of a high dcr inductor will cause an induc tor loss, resulting in decreased output voltage. should this condition continue for a specified period (soft start time + timer latch time), output short circ uit protection will be activated and output will be latched off. when using an inductor over 0.1 , be careful to ensure adequate margins for variation between external devices and this ic, including transient as well as static characteristics. furthermore, in any case, it is recommended to start up the output with en after supply voltage is within oper ation range. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd parasitic element
20 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ordering information b d 8 9 6 3 e f j e 2 part number package efj : htsop - j8 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information msop8(top view) d 8 9 part number marking lot number 1pin mark 6 3
21 / 21 BD8963EFJ d ata s heet 02.mar.2012 rev.001 www.rohm.com tsz 0 2201 - 0j3j0aj00040 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 revision history date revision changes 17.jan.2012 001 new release
datasheet d a t a s h e e t notice - rev.001 notice precaution for circuit design 1) the products are designed and produced for applicatio n in ordinary electronic equipment (av equipment, oa equipment, telecommunication equipment, home appliances, amusement equipment, etc.). if the products are to be used in devices requiring extremel y high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel contro llers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the rohm sales staff in advance. if product malfunctions may re sult in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits in the case of single-circuit failure 2) the products are designed for use in a standard environment and not in any spec ial environments. a pplication of the products in a special environment can deteriorate product per formance. accordingly, verification and confirmation of product performance, prior to use, is recomm ended if used under the following conditions: [a] use in various types of liquid, includin g water, oils, chemicals, and organic solvents [b] use outdoors where the products are exposed to direct sunlight, or in dusty places [c] use in places where the products are exposed to sea winds or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use in places where the products are exposed to static electricity or electromagnetic waves [e] use in proximity to heat-producing componen ts, plastic cords, or other flammable items [f] use involving sealing or coating the prod ucts with resin or other coating materials [g] use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] use of the products in places subject to dew condensation 3) the products are not radiation resistant. 4) verification and confirmation of performance characte ristics of products, after on- board mounting, is advised. 5) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 6) de-rate power dissipation (pd) depending on ambient temperature (ta). when used in sealed area, confirm the actual ambient temperature. 7) confirm that operation temper ature is within the specified range described in product specification. 8) failure induced under deviant condition from what def ined in the product specific ation cannot be guaranteed. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the remainder of fl ux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the company in advance. regarding precaution for mounting / circu it board design, please specially refe r to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) the application examples, their const ants, and other types of information cont ained herein are applicable only when the products are used in accordance with standard methods . therefore, if mass production is intended, sufficient consideration to external conditions must be made.
datasheet d a t a s h e e t notice - rev.001 precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution during manufacturing and st oring so that voltage exceeding product ma ximum rating won't be applied to products. please take special care under dry condition (e.g. grounding of human body / equipment / so lder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriorate if the products are stored in the following places: [a] where the products are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] where the temperature or humidity exceeds those recommended by the company [c] storage in direct sunshine or condensation [d] storage in high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding recommended storage time period . 3) store / transport cartons in the correct direction, whic h is indicated on a carton as a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a dry bag. precaution for product label qr code printed on rohm product label is only for internal us e, and please do not use at cust omer site. it might contain a internal part number that is inconsistent with an product part number. precaution for disposition when disposing products please dispose them properly with a industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under controlled goods prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. prohibitions regarding industrial property 1) information and data on products, including application exam ples, contained in these specifications are simply for reference; the company does not guarantee any industrial pr operty rights, intellectual property rights, or any other rights of a third party regarding this information or data. ac cordingly, the company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the us e of the products listed herein. 2) the company prohibits the purchaser of its products to exercise or use the in tellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the company, other than the right to use, sell, or dispose of the products.

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